SMBJ5.0A-E3

FEATURES• Low profile package• Ideal for automated placement• Glass passivated chip junction• Available in uni-directional and bi-directional• 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 %• Excellent clamping capability• Very fast response time• Low incremental surge resistance• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C• AEC-Q101 qualified available    - Automotive ordering code: base P/NHE3 or P/NHM3• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 AvailableTYPICAL APPLICATIONS    Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, and telecommunication.

主な特長

• Low profile package,Ideal for automated placement,Glass passivated chip junction

応用

• Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, and telecommunication.