W25M02GVZEIG

The W25M02GVZEIG flash memory chip, manufactured by Winbond, stands out as a game-changer in electronic devices, offering a remarkable 2-gigabyte capacity with a range of features that set it apart. Renowned for its high-speed data transfer rates and low power consumption, this chip is the go-to choice for portable gadgets such as smartphones, tablets, and digital cameras. Its serial interface ensures seamless communication with the host system, making it highly suitable for embedded applications. Moreover, the support for the industry-standard SPI protocol allows for easy integration into existing systems, making it incredibly versatile. Additionally, the chip boasts advanced security features, including hardware-based data protection and encryption, guaranteeing the safety of stored information, a crucial aspect in today's digital landscape

主な特長

• New Family of SpiFlash Memories
• – W25M02GV: 2x1G-bit / 2x128M-byte
• – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
• – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
• – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
• – Compatible SPI serial flash commands
• Highest Performance Serial NAND Flash
• – 104MHz Standard/Dual/Quad SPI clocks
• – 208/416MHz equivalent Dual/Quad SPI
• – 50MB/S continuous data transfer rate
• – Fast Program/Erase performance
• – More than 100,000 erase/program cycles
• – More than 10-year data retention
• Efficient “Continuous Read Mode”(1)
• – Alternative method to the Buffer Read Mode
• – No need to issue “Page Data Read” between
• Read commands
• – Allows direct read access to the entire array
• Flexible “Concurrent Operations”
• – Independent single die access
• – Allows “Read while Program/Erase”
• – Allows “Multi Die Program/Erase”
• – Improves Program/Erase throughput
• Low Power, Wide Temperature Range
• – Single 2.7 to 3.6V supply
• – 25mA active, 20µA standby current
• – -40°C to +85°C operating range
• Flexible Architecture with 128KB blocks
• – Uniform 128K-Byte Block Erase
• – Flexible page data load methods
• Advanced Features
• – On chip 1-Bit ECC for memory array
• – ECC status bits indicate ECC results
• – bad block management and LUT(2) access
• – Software and Hardware Write-Protect
• – Power Supply Lock-Down and OTP protection
• – 2KB Unique ID and 2KB parameter pages
• – Ten 2KB OTP pages(3)
• Space Efficient Packaging
• – 8-pad WSON 8x6-mm
• – 24-ball TFBGA 8x6-mm
• – Contact Winbond for other package options